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Editorial Board

We are seeking professionals to join our Editorial Board. If you are interested in becoming an Editor, please send your CV and a one-page summary of your specific expertise and interests to the following email address. We will review your information and if appropriate, we will place you on our list of Editorial Board.

Please send your application to: editor@etpub.com.

Editor-in-Chief

Yang Xiao
The University of Alabama, Tuscaloosa, USA
Email: yangxiao@ieee.org
Kia Makki
Technological University of America, USA
Email: kia.makki@gmail.com






Associate Editor-in-Chief

Maode Ma
Nanyang Technological University, Singapore
Email: emdma@ntu.edu.sg
Jalel Ben-Othman
University of Paris, France
Email: jalel.ben-othman@univ-paris13.fr
Nobuo Funabiki
Department of Electrical and Communication Engineering
Okayama University, Japan
Email: funabiki@okayama-u.ac.jp
Yuesheng Zhu
Peking University Shenzhen Graduate school, China
Email: zhuys@pkusz.edu.cn

 









Executive Editor-in-Chief

Jason Z. Kang
UESTC, China
Email: jcm@etpub.com


Advisory Board
Nirwan Ansari  (IEEE Fellow)
New Jersey Institute of Technology, USA
 
Mohsen Guizani  (IEEE Fellow)
University of Idaho, USA 
 
Yuguang "Michael" Fang  (IEEE Fellow)
University of Florida, USA
 
Forouzan Golshani  (IEEE Fellow)
California State University, Long Beach, USA
 
Raj Jain  (IEEE/ACM Fellow)
Washington University in St. Louis, USA 
 
Abbas Jamalipour  (IEEE Fellow)
University of Sydney, Australia
 
Aggelos K. Katsaggelos  (IEEE Fellow)
Northwestern University, USA    
 
Demetrios Kazakos  (IEEE Fellow)
Texas Southern University, USA
 
P. R. Kumar  (NAE Member, IEEE Fellow)
University of Illinois, Urbana-Champaign, USA
 
S. Y. Robert Li  (IEEE Fellow)
Chinese University of Hong Kong, China  
 
Mohammad S. Obaidat  (IEEE Fellow)
Monmouth University, USA   
 
Kannan Ramchandran  (IEEE Fellow)
University of California, Berkeley, USA  
 
Sherman Shen (IEEE Fellow)
University of Waterloo, Canada
 
Ness B. Shroff  (IEEE Fellow)
Ohio State University, USA    
 
Mukesh Singhal  (IEEE Fellow)
University of Kentucky, USA   
 
Mani Srivastava  (IEEE Fellow)
University of California, Los Angeles, USA   
 
John A. Stankovic  (IEEE/ACM Fellow)
University of Virginia, USA   

Mo Jamshidi
University of Texas at San Antonio, USA
 
Wojciech Mazurczyk
Faculty of Electronics and Information Technology, Warsaw University of Technology, Poland
 
Taieb Znati
NSF, USA

Editorial Board

Xiang-Gen Xia  (IEEE Fellow)
University of Delaware, USA
 
George S. Tombras
National and Kapodistrian University of Athens, Greece
 
Huaxiong Wang
Nanyang Technological University, Singapore
 
Mea Wang
University of Calgary, Canada
 
Antonios Argyriou
Philips, Netherland
 
Yupeng Wang,
Shenyang Aerospace University, China
 
Weifa Liang,
Australian National Unversity, Australia
 
Hong Shen,
The University of Adelaide, Australia
 
José Manuel Molina López,
Universidad Carlos III De Madrid, Spain
 
Michael Sheng,
The University of Adelaide, Australia
 
Yuesheng Zhu,
Peking University Shenzhen Graduate School, China
 
Jay Blumler,
University of Leeds, England
 
Meng Joo Er,
Nanyang Technological University, Singapore
 
Angela Yingjun Zhang,
The Chinese University of Hong Kong, Hong Kong
 
Abdul Razaque,
Oklahoma State University, USA
 
Bin Xiao,
Hong Kong Polytechnic University, Hong Kong
 
Sherali Zeadally,
College of Communication and Information, University of Kentucky, USA
 
Jenq-Shiou Leu,
National Taiwan University of Science and Technology, Taiwan
 
Jarno Limnéll,
Department of Communications and Networking, Aalto University, Finland
 
Karl Andersson,
Lulea University of Technology, Sweden
 
Miroslav Voznak,
Technical University of Ostrava, Czech Republic
 
Rosli Bin Salleh,
University of Malaya, Kuala Lumpur, Malaysia
 
Siti Mariyam Shamsuddin,
Universiti Teknologi Malaysia, Malaysia
 
Sameem Abdul Kareem,
University of Malaya, Kuala Lumpur, Malaysia
 
Hongyuan Gao,
Harbin Engineering University, China
 
Mariusz Głąbowski,
Poznan University of Technology, Poland
 
Saviour Zammit,
University of Malta, Malta
 
Qingsheng Zeng
Communications Research Centre, Canada

Xinheng (Henry) Wang
University of the West of Scotland, UK

Wen Ji
Chinese Academy of Sciences, China

Christos Kalialakis
Centre Tecnologic de Telecomunicacions de Catalunya, Spain

Tarek Abdelzaher
University of Illinois, Urbana-Champaign, USA
 
Mohammed Atiquzzaman
University of Oklahoma, USA
 
John F. Buford
Avaya Labs, USA
 
Senad Busovaca
California State University, Sacramento, USA
 
R. (Mouli) Chandramouli
Stevens Institute of Technology, USA
 
Michael Devetsikiotis
North Carolina State University, USA
 
Zhenhai Duan
Florida State University, USA
 
Tian He
University of Minnesota, USA
 
Zhihai He
University of Missouri, Columbia, USA
 
Ahmed E. Kamal
Iowa State University, USA
 
Masoumeh Karimi,
Technological University of America, USA
 
Andres Kwasinski
Rochester Institute of Technology, USA
 
Jin Li
Microsoft Research, USA
 
Lavy Libman,
University of Sydney, Australia
 
Hai Liu
Hong Kong Baptist University, China
 
Kammi Makki
Lamar University, USA
 
Shamila Makki
Horizon Electronics, USA
 
EK Park
City University of New York, USA
 
Joel Rodrigues
University of Beira Interior, Portugal
 
Sana Sfar
InterDigital Communications, USA
 
Min Song
Old Dominion University, USA
 
Guan-Ming Su
Marvell Semiconductors, USA
 
Weifeng Su
State University of New York at Buffalo, USA
 
Hideki Tode,
Osaka Prefecture University, Japan
 
Athanasios(Thanos) Vasilakos
University of Western Macedonia, Greece
 
Tingkai Wang
London Metropolitan University, UK
 
Hsiao-Chun Wu
Louisiana State University, USA
 
Wenjun Zeng
University of Missouri, USA
 
Fan Zhai
Texas Instrument, USA
 
Qian Zhang
Hong Kong University of Science & Technology, China
 
Xiaobo Zhou
University of Colorado at Colorado Springs, USA

Hassan Moradi
Qualcomm Inc, San Diego, CA, USA

Lunchakorn Wuttisittikulkij
Chulalongkorn University, Thailand

Chaodit Aswakul
Chulalongkorn University, Thailand

Sharul Kamal Abd. Rahim
Universiti Teknologi Malaysia, Malaysia
 
Muhammad Ramlee Kamarudin
Universiti Teknologi Malaysia, Malaysia

K. Seshadri Sastry
Gandhi Institute of Engineering and Technology, India

Laiha Mat Kiah
University of Malaya,Kuala Lumpur, Malaysia

Curri Vittorio
Polytechnic University of Turin, Germany

Priv.-Doz. Dr. Dr.-Ing. Jean Chamberlain Chedjou
Alpen Adria Universität, Klagenfurt, Austria

Betsy J. Bannier
Lake Region State College, USA

Prof.Doan Hoang
University of Technology Sydney, Australia

Vittorio Camarchia
Department of Electronics and Telecommunications of the Politecnico di Torino, Italy
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